אהרון שלום, במפרט IPC-7711/21 כתוב במפורש כך:
1 General
1.1 Scope This document covers procedures for repairing
and reworking printed board assemblies. It is an aggregate
of information collected, integrated and assembled by
the Repairability Subcommittee (7-34) of the Product
Assurance Committee of the IPC. This revision includes
expanded coverage for lead free processes, and additional
inspection guidelines for operations such as repair that may
not have other published criteria.
This document does not limit the maximum number of
rework, modification or repair actions to a Printed Circuit
Assembly.
היות וזהו המפרט הקובע לגבי תיקונים וכך יש להתייחס אליו. אין בשום מקום אחר התייחסות לנושא זה.
אריה
